Programs : Brochure
This page is the brochure for your selected program. You can view the provided information for this program on this page and click on the available buttons for additional options.
- Locations: Singapore, Singapore
- Program Terms: EAP Fall, EAP Spring, EAP Year (academic)
- Homepage: Click to visit
Dates / Deadlines:
|Term||Year||UCM Deadline||Campus Decision Date||Start Date||End Date|
|EAP Spring||2024||07/06/2023 **||Rolling Admission||TBA||TBA|
** Indicates rolling admission application process. Applicants will be immediately notified of acceptance into this program and be able to complete post-decision materials prior to the term's application deadline.
|Click here for a definition of this term Minimum GPA:||2.85||Click here for a definition of this term Class standing:||2-Sophomore, 3-Junior, 4-Senior|
|Language of instruction:||English||Housing options:||Dormitory / affiliated residences, Private apartments|
|Click here for a definition of this term Areas of study:||Bioengineering, Computer science, Electrical engineering, Engineering, Materials Science, Mathematics, Mechanical engineering||Click here for a definition of this term Study Abroad Advisor:||Jennifer Heinrich|
|Financial aid available?:||Yes||Click here for a definition of this term New Program:||Yes|
|Click here for a definition of this term GEs Pre-Approved:||Intellectual Experience G: Global Awareness|